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Kirill V. Belyayev
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KIRILL V. BELYAYEV

kirill@kbelyayev.com
+1 (909) KIRILLL kbelyayev.com

SUMMARY STATEMENT

Highly competent result oriented Embedded Design Engineer experienced in successful full life cycle product development in the toughest time constrains. Capable to materialize ideas into real life, independently find solutions to most challenging problems and deliver results in the fastest manner. Extensive hardware and software development experience accompanied by leadership, communication and interpersonal skills. Eager to apply my skills and knowledge to benefit your company.

CORE COMPETENCIES

Product Development/Testing

Hardware/Software/Layout

Digital and Analog Design

Programmable Logic

Microprocessors and DSPs

GUI Development

Web Development

Coding Ninja

Productivity and Efficiency

Component Research/Integration

Mass Production

Creative Problem Solving

Goal and Detail Orientation

Self-sufficiency and Leadership

Excellent Interpersonal skills

Diverse life experiences

Unique Personality

PROFESSIONAL EXPERIENCE

Contract Engineering, Boulder, CO

October, 2010 - Present

  • Exercising independency and self-sufficiency, solving wide range of problems in quickly changing environments and challenging atmosphere
  • Developing hardware/software for Penn State University, Earth Science Systems, CEPD, JOWA USA, Cartasite, CIMA Systems, Trimble, Ubiquiti Networks and other companies
  • Working on personal projects, in-depth design using Altium, SolidWorks, VisualCAM and AVR Studios
  • Hands on mechanical prototyping experience including CNC machining, 3D Printing, Metal Welding, Soldering, Assembly
  • Developing non-profit community with 300+ members as well as personal website

Embedded Design Engineer, AeroStream Communications, Golden, CO

November 2008 - May 2010

  • Successfully completed 4 projects in a fast paste, multitask, small company environment
  • Achieved product idea to working prototype in 9 months
  • Created architecture for 4 channel SDR(Software Defined Radio system) spread out on up to 8 boards (for the noise reducing reasons) achieving most ergonomic design in the tightest mechanical constrains
  • Designed multichannel RF boards (mostly 6-layer) from scratch. Identifying gain and loss requirements, implementing very efficient design geared towards minimizing noise influence on the analog components
  • Designed highly complex, self-sufficient DSP boards (2x4 inch 10-layer DSP daughter card with 256-pin 400K Gate 1mm-pitch FPGA, 289-pin 0.5mm-pitch DSP, SDRAM, FLASH, NAND and USB unit)
  • Investigated numerous RF and DSP components in order to balance best performance and price
  • Identified ways to dramatically reduce cost and simplify design while maintaining best performance
  • Oversaw board fabrication and assembly processes insuring highest quality standards

Electrical Engineer, Colorado Electronic Product Design, Boulder, CO

October 2006 - October 2008

  • Successfully conducted advanced research and design in a wide variety of different fields and applications
  • Solely designed and debugged code for the Digital Reading Service Receiver project, code proved to be extremely reliable in the field by successful implementation on thousands of units
  • Significant VHDL code contribution to the Digital Radio Kit Project including code writing, debugging and testing. Final code was implemented on both Xilinx and Altera FPGAs
  • Detailed testing of the Land Seismic Acquisition System. Numerous ways to improve system efficiency and productivity were discovered and successfully implemented
  • Conquered detailed electronic assembly using soldering irons, hot air and IR machines, successfully applied and developed my skills to perfection while creating prototypes, testing and modifying existing circuits
  • As a result of displaying hard work accompanied by impressive outcomes and dedication to the company, I quickly progressed from the part-time Intern to the full-time Engineer position

Engineering Intern, The Children's Hospital, Aurora, CO

June 2006 - October 2006

  • Participated in constructing 1.45 million square foot nine floor hospital designed to accommodate 270 beds, 14 operating rooms, 2 cardiology surgical operating rooms and 9 minor surgical procedure suites
  • Actively assisted and enthusiastically proposed numerous ideas during inspections, meetings and new technology applications
  • Closely worked with Senior Engineers, organized and modified construction plans using AutoCAD as well as developed databases for future service and maintenance using ArchiBus software
  • Independently worked on power consumption estimation for the whole hospital

EDUCATION

Erasmus Mundus Master Program in Embedded Computing Systems (Dropped out)

August 2011 - December 2011

University of Kaiserslautern (TUK), Kaiserslautern, Germany

Norwegian University of Science and Technology, Trondheim, Norway

Embedded Systems Certificate, May 2009

University of Colorado at Boulder, CO

Bachelor of Science in Electrical Engineering, May 2008

University of Colorado at Boulder, CO

Metropolitan State College of Denver, CO

September 2005 - May 2006

Major: Electrical Engineering

Omsk State Transport University, Russia

September 2001 - July 2004

Major: Thermal Engineering

TECHNICAL SKILLS

  • Trilingual: Perfect written/oral English and Russian, Intermediate German
  • Other Languages: C, C++, Python, Java, Assembly, VHDL, Verilog, Basic, Linux Driver/Kernel development, UML
  • Python Modules: PyQt, pcapy, impacket, pyserial, bbfreeze, pyftpdlib, bottle, pymodbus, tornado, pyasn1, pysnmp, pycrypto, crontab, mysql, matplotlib, sphinx, pylint, pyreverse, twisted, uncompyle, zope
  • Smart Phone development: App and hardware development for Android and Apple systems
  • Script/GUI development under Windows, Linux, Embedded Linux operating systems
  • Web-development: HTML, CSS, Javascript, PHP, Python , AJAX, SQL, Web Sockets, JQuery, Flot
  • Version Control: Git, GitHub, BitBucket, Subversion
  • Tools: Eagle, Altium, PADs Layout and Schematic, Xilinx, Questasim, PSPICE, Multisim, Microwave Office, Electronic Workbench, SolidWorks, AutoCAD, MathLab, Microsoft Office Suite
  • Experience in Schematic Capture, PCB Layout, Part Selection and BOM creation
  • Hardware: TI MSP430, Freescale HCS08, Siemens C501, Atmel C51, Atmega328P, Atmega128RFA1, Atmel SAM D20, Motorola MC68000 and 56300 (DSP), BlackFin 527C (DSP) Processors
  • FPGAs: Xilinx Spartan 3, Spartan 5, Spartan 6, Virtex 5 and Altera Cyclone 3 FPGAs
  • Protocols: SPI, I2C, RS232, PWM, Zigbee, Bluetooth, USB, Ethernet, and others
  • Network Protocols: TCP, UDP, FTP, Modbus, SNMP as well as proprietary protocols
  • Interfaces: SRAM, EEPROMs, RTCs, Digital and Analog Sensors (Temperature, Pressure, Humidity), Character and Graphical LCDs, PCI interface, PLL, RF mixers, Zigbee modem, AM/PM Transmitters/Receivers, TCP/IP PHY, ADC, DAC, LVDS, JTAG, Audio/Modem Codecs, Keypads, Switches, LEDs, DC Brush/Brushless/Stepper Motors, Hall Effect and Photo-interrupter switches
  • Theoretical/Practical knowledge of DSP concepts, FIR and IIR filters, Signal Generation, Image Processing
  • Design of Analog circuitry including Power, Amplifiers, Filters and RF
  • Other Skills: Iron, Hot Air, Infrared Soldering and other assembly skills
  • Extended Mechanical Design knowledge(Enclosure, Mold and Fixture designs in SolidWorks)
  • Mechanical Prototyping skills including CNC Machining, 3D Printing and Metal Welding
  • IT, server and virtual machine experience

PERSONAL

  • Citizenships: United States of America, Russia, StackOverflow, GitHub
  • Interests: Rock/Ice Climbing, Mountaineering, Mountain Biking, Ice Hockey, Telemark Skiing, Scuba Diving, Paragliding, Traveling, Personal Development, Entrepreneurship

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